(C) Nikkei Asia

SAN JOSE, CA — ASML, the Dutch lynchpin of the global semiconductor supply chain, has officially declared that its next-generation lithography system, the High-NA (High Numerical Aperture) EUV, is ready for high-volume manufacturing (HVM). This announcement marks a definitive turning point in the race to produce the world’s most advanced AI processors and underpins the industry’s roadmap toward sub-2nm nodes.

The Gold Standard for Sub-2nm Nodes
In an exclusive interview with Reuters ahead of a major technical conference in San Jose, Marco Pieters, ASML’s Chief Technology Officer (CTO), revealed that the company's latest system (the Twinscan EXE:5000 series) has reached the critical performance metrics required for commercial deployment.

"The High-NA EUV tool is no longer just a laboratory marvel; it is ready to be the workhorse of the next decade," Pieters stated. He highlighted three key data points that underscore this readiness:

500,000 Wafers Processed: The fleet of High-NA tools has already processed over half a million test wafers, allowing ASML to iron out early-stage technical glitches.
Uptime Targets: Current equipment 가동률(uptime) stands at 80%, with ASML aiming to reach the industry-standard 90% by the end of 2026.
Imaging Precision: The system has demonstrated the ability to print circuit patterns with a resolution of 8nm, compared to 13nm in standard EUV systems.

Why "High-NA" Matters: 0.33 vs. 0.55
At the heart of this leap is the Numerical Aperture (NA). While current EUV machines use an NA of 0.33, the High-NA system increases this to 0.55. In simple terms, a higher NA allows the lens to collect more light and focus it more precisely.

For chipmakers like Intel, TSMC, and Samsung, this means they can draw finer lines in a single pass. Currently, using 0.33 NA EUV for 2nm or 1.4nm processes requires "multi-patterning"—printing the same layer multiple times to achieve the desired density. High-NA reduces these complex, multi-step processes into a single exposure, significantly lowering defect rates and shortening production cycles.

The $400 Million Price Tag and the Competitive Landscape
The technological leap comes with a staggering cost. Each High-NA EUV machine is priced at approximately $400 million (approx. 576 billion KRW), nearly double the price of previous models.

Intel: Has been the most aggressive adopter, already installing its first systems in Oregon to regain its manufacturing lead with the 14A (1.4nm) node.
TSMC & Samsung: While both have secured units, they are taking a more cautious approach, balancing the high cost of the equipment against the efficiency gains. TSMC is expected to integrate High-NA more broadly for its A14 node around 2027–2028.

The Road Ahead: Integration and AI Growth
Despite the "ready for production" status, Pieters noted that it will take 2 to 3 years for these systems to be fully integrated into existing fab lines. The industry must first optimize new photoresists, masks, and etching processes tailored for the 0.55 NA optics.

However, the urgency is real. As AI models like OpenAI’s Sora and next-gen ChatGPT demand exponentially more powerful chips, the current 0.33 NA EUV technology is hitting its physical limits. ASML’s announcement provides the roadmap the industry needs to keep pace with the AI revolution.

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