Qnity Electronics is accelerating "material innovation" through customer collaboration. In particular, the company is stepping up its efforts to target the advanced packaging market, which has rapidly emerged as core to enhancing semiconductor performance in the artificial intelligence (AI) era.

According to industry sources on the 25th, Qnity—which spun off from DuPont in 2025 to launch as an independent company—is strengthening customer partnerships leveraging over 50 years of technological innovation and manufacturing expertise. Beyond simply supplying semiconductor materials, the company is attempting multi-faceted collaborations with customers starting from the initial design phase. This strategic move aims to comprehensively reinforce material innovation, including advanced packaging.

Qnity’s strategy is also proving successful in South Korea. Currently, Qnity has established business operations in Seoul, Hwaseong, and Cheonan. Among them, the Cheonan site serves as a core hub producing advanced materials used in semiconductor manufacturing processes, advanced packaging, and lithography. It supports securing the performance, reliability, and scalability required for next-generation computing and AI technologies, while also driving next-generation innovations in advanced display fields such as OLED.

The research and development (R&D) facility located in Hwaseong, the Qnity Korea Technology Center (KTC), serves as a central hub for customer collaboration. The KTC features customized prototyping capabilities for Korean customers, characterization laboratories, and engineering test facilities. It functions as a space where major semiconductor manufacturers "co-develop" technologies. By collaborating closely with customers from the early stages of material and technology development through to mass production, the center supports technology commercialization.

By combining global technological leadership with local technical expertise and application engineering support, Qnity’s "local-centric" strategy aligns with customer technology roadmaps, shortening development cycles and enhancing responsiveness to market changes.

Qnity’s strategy aligns closely with paradigm shifts in the semiconductor industry. Recently, with surging demand for AI and high-performance computing (HPC), relying solely on traditional scaling down based on "Moore’s Law" has faced limitations in improving performance and efficiency.

This means that the core of semiconductor performance and efficiency no longer depends merely on reducing individual chip sizes, but on how complex chips are precisely integrated, packaged, and interconnected as sophisticated systems. This is why Qnity focuses on innovative materials that support technologies such as advanced packaging, chiplets, heterogeneous integration, and 3D architectures.

To this end, Qnity is focusing on securing "end-to-end system" level solutions spanning the entire semiconductor manufacturing process, including chemical mechanical planarization (CMP), advanced cleaning, lithography materials, advanced interconnects, thermal management, and EMI shielding technologies. Through this, the company plans to strengthen its role as a technology partner, helping customers quickly bring next-generation AI, high-performance computing, and advanced electronic platforms to market.

Jon Kemp, CEO of Qnity, stated, “From the earliest design stages, Qnity works hand-in-hand with global brands and next-generation technology leaders to co-create innovation. In an era where scaling and stacking are accelerating, close collaboration and co-innovation across the semiconductor ecosystem are the keys to success.”

Currently, approximately 1,000 employees work across Qnity Korea’s sites in Seoul, Hwaseong, and Cheonan. While continuously strengthening its business and technical capabilities within South Korea, the company also earned a "Great Place to Work" certification in 2026.

[ⓒ Global Economic Times. 무단전재-재배포 금지]